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PCBA-SMT
Surface mount, through-hole, RoHS / Non-RoHS, and clean / no-clean soldering processes.
PROCESS / TEST
- Surface Mount, Through-Hole, RoHS / Non-RoHS
- Flex-Rigid Board Soldering & Hot Bar Soldering
- AOI, BGA 2D X-Ray Inspection
- ICT / FCT, Conformal Coating, IC Programming, Temp Cycle
EQUIPMENT / SPEC
- Samsung S2 / S1 P&P
- Max Board Size 510 × 510 mm
- Component Size 03015+ / pitch ≥ 0.3 mm
- Total Capacity 350K pcs / hr